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Entities25 of 207,987
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Entity
Bump Chip on Substrate
technology2 mentionslast seen Nov 11, 2026
Packaging technology eliminating wire bonding introduced by Raytron at CIOE 2026.
Relationships 1
Relationship
RaytrondevelopsBump Chip on Substrate
99% confidence2 supporting mentions
Either name opens that entity’s relationships.
Sources 2
- newsPR NewswireNov 11, 2026Top 5 Thermal Camera Manufacturers Capture 90% of the Market as Raytron Leads Global Thermal Imaging Shipments
Raytron introduced BCoS (Bump Chip on Substrate) packaging technology
- newsPR NewswireNov 11, 2026Top 5 Thermal Camera Manufacturers Capture 90% of the Market as Raytron Leads Global Thermal Imaging Shipments
At CIOE 2026, Raytron introduced BCoS (Bump Chip on Substrate) packaging technology