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Entities25 of 207,987
- large language modeltechnology1,048 mentions
- robotic manipulationmarket834 mentions
- artificial intelligencetechnology739 mentions
- reinforcement learningtechnology492 mentions
- density-functional theorytechnology386 mentions
- Transformertechnology372 mentions
- vision-language-action modeltechnology355 mentions
- agentic AItechnology353 mentions
- Vision-Language Modeltechnology321 mentions
- U.S. Food and Drug Administrationorganization320 mentions
- Microsoftorganization291 mentions
- Googleorganization276 mentions
- NVIDIAorganization264 mentions
- Model Context Protocoltechnology232 mentions
- machine learningtechnology204 mentions
- MarketsandMarketsorganization199 mentions
- Claudeproduct192 mentions
- AI agenttechnology188 mentions
- ChatGPTproduct178 mentions
- Anthropicorganization177 mentions
- integrated sensing and communicationtechnology176 mentions
- Amazon Web Services, Inc.organization174 mentions
- OpenAIorganization172 mentions
- diffusion modeltechnology170 mentions
- IBMorganization163 mentions
Entity
ACM Research
organization10 mentionslast seen Nov 5, 2026
Supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications.
Relationships 28
- ACM ResearchownsACM Research (Shanghai), Inc.99% confidence4 sources
- ACM ResearchemploysDavid Wang99% confidence3 sources
- ACM ResearchdevelopsSingle-Wafer Hot SPM system99% confidence2 sources
- ACM Researchdevelopsvertical furnace process99% confidence2 sources
- ACM Researchdevelopsstress-free polishing99% confidence2 sources
- ACM Researchdevelopselectroplating99% confidence2 sources
- ACM Researchdevelopsplasma-enhanced chemical vapor deposition99% confidence2 sources
- ACM ResearchemploysMark McKechnie97% confidence1 source
- ACM ResearchcommercializesSingle-Wafer Hot SPM system95% confidence1 source
- ACM ResearchdevelopsUltra ECP ap-p95% confidence1 source
- ACM Researchdevelopssemiconductor process equipment93% confidence1 source
- ACM Researchcommercializessemiconductor process equipment93% confidence1 source
- ACM Researchdevelops310×310 mm Ultra ECP panel-level horizontal electroplating production tool92% confidence1 source
- ACM ResearchcommercializesUltra ECP ap-p92% confidence1 source
- ACM Researchdevelopswafer processing equipment90% confidence1 source
- ACM Researchdevelopswafer-level packaging90% confidence1 source
- ACM Researchdevelopspanel processing equipment90% confidence1 source
- ACM Researchdevelops515 × 510 mm R&D tool90% confidence1 source
- ACM Researchdevelopselectrochemical plating90% confidence1 source
- ACM Researchdevelopspanel processing90% confidence1 source
- ACM Researchdevelopspanel-level packaging90% confidence1 source
- ACM Researchdevelopswafer cleaning90% confidence1 source
- ACM Researchdevelopswafer processing90% confidence1 source
- patent-pending horizontal electroplating technologyassigned toACM Research88% confidence1 source
- ACM Researchdevelopscleaning technology87% confidence1 source
- ACM Researchdevelopspatent-pending horizontal electroplating technology85% confidence1 source
- ACM ResearchdevelopsTahoe85% confidence1 source
- ACM Researchdevelopscleaning85% confidence1 source
Relationship
ACM Researchdevelopsplasma-enhanced chemical vapor deposition
99% confidence2 supporting mentions
Either name opens that entity’s relationships.
Sources 2
- newsGlobeNewswireOct 28, 2026ACM Research Announces Preliminary Unaudited Revenue and Shipments for the Third Quarter 2026
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools
- filingSEC EDGARSep 30, 2026ACM Research, Inc. 8-K: Item 8.01: Other Events; Item 9.01: Financial Statements and Exhibits
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD